When most people hear “solid-state,” they think storage. But in Santa Clara, xMEMS Labs just gave that term new resonance, literally. The company just raised $21M in Series D funding led by Boardman Bay Capital Management, with Cloudview Capital, CDIB-TEN Capital, Harbinger Venture Capital, SIG Asia Investments, and other strategic investors tuning in. This isn’t another round of capital, it’s an amplifier for a company turning silicon into a new language of sound and cooling for the AI era.
Founded in 2018 by Joseph Jiang and Jemm Liang, xMEMS spun out of piezoelectric R&D at TSMC and turned what was once wafer-level theory into commercial hardware. Joseph Jiang, a veteran of Knowles, Fortemedia, and InvenSense, leads with precision and swagger, while Jemm Liang, who built Ultrachip from the ground up, drives the engineering with surgical focus. Co-Founder & CLO Wei-Fu Hsu, the former MediaTek exec and IP expert, ensures xMEMS’ innovation is as protected as it is disruptive.
Their play? A monolithic MEMS platform that transforms voltage into vibration, silicon into sound. Unlike legacy coil speakers and fans, xMEMS tech doesn’t move parts, it moves markets. Over 500K MEMS speakers shipped in 1H’24, backed by more than 250 global patents. The Cypress & Sycamore lines redefine what “small” can do: 1mm-thin, full-range, and capable of sub-bass response once thought impossible in earbuds. Their XMC-2400 µCooling chip, 1mm-thin, fan-on-a-chip, inaudible, moves 39cc/sec of air at just 30mW. That’s not cooling, that’s choreography at a molecular level.
Dr. Chester Hwang, named CTO on Oct 15, 2025, joins to push that curve further. Alongside veterans Mike Housholder (VP Marketing & Biz Dev), Jim Wargnier (VP N.A. & EU Sales), James Lee (VP & Korea GM), Steven Bentley (VP Sales), and Martin Lim (VP MEMS Tech), xMEMS is scaling at semiconductor speed. They’re already in BleeqUp’s AI sports glasses and teamed with Dongguan Rayking Electronics for TWS modules. When OEMs talk “next-gen,” they’re talking xMEMS-level integration.
For investors like Boardman Bay’s Will Graves, this isn’t just sound engineering, it’s signal intelligence. With AI pushing devices thinner, faster, and hotter, xMEMS’ piezoMEMS platform sits at the intersection of acoustics and thermals, where every millimeter matters. Backing them is a bet that the next wave of sensory tech won’t just compute, it’ll feel alive.
So what’s next? Scaling production, expanding capacity, and embedding xMEMS’ silicon pulse into everything from earbuds to AI data centers. In a world chasing speed, silence, and fidelity, xMEMS isn’t following the beat, they’re building the frequency the future will hum to.
